cystech electronics corp. spec. no. : c710q8 issued date : 2009.05.07 revised date : page no. : 1/6 MTB06N03Q8 cystek product specification n-channel logic level enhancement mode power mosfet MTB06N03Q8 bv dss 30v i d 18a r dson(max) 6.8m description the MTB06N03Q8 is a n-channel enhancement-mode mosfet, providing the designer with the best combination of fast switching, ruggedized device de sign, low on-resistance and cost effectiveness. the sop-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applicati ons such as dc/dc converters. features ? single drive requirement ? low on-resistance ? fast switching characteristic ? dynamic dv/dt rating ? repetitive avalanche rated ? pb-free and halogen-free package symbol outline MTB06N03Q8 sop-8 pin 1 g gate d drain s source
cystech electronics corp. spec. no. : c710q8 issued date : 2009.05.07 revised date : page no. : 2/6 MTB06N03Q8 cystek product specification absolute maximum ratings (ta=25 c) parameter symbol limits unit drain-source voltage v ds 30 gate-source voltage v gs 20 v continuous drain current @ t c =25 c 18 continuous drain current @ t c =100c i d 12 pulsed drain current i dm 72 *1 avalanche current i as 20 a avalanche energy @ l=0.1mh, i d =20a, r g =25 e as 20 repetitive avalanche energy @ l=0.05mh e ar 10 *2 mj t a =25 3 total power dissipation t a =100 p d 1.5 w operating junction and storage temp erature range tj, tstg -55~+175 c thermal data parameter symbol value unit thermal resistance, junction-to-case, max r th,j-c 25 c/w thermal resistance, junction-to-ambient, max r th,j-a 50 *3 c/w note : 1. pulse width limited by maximum junction temperature 2. duty cycle 1% 3. surface mounted on 1 in2 copper pad of fr-4 board, 125 c/w when mounted on minimum copper pad characteristics (t c =25 c, unless otherwise specified) symbol min. typ. max. unit test conditions static bv dss 30 - - v v gs =0, i d =250 a v gs(th) 1.0 1.5 3.0 v v ds = v gs , i d =250 a g fs *1 - 25 - s v ds =5v, i d =18a i gss - - 100 na v gs = 20 - - 1 v ds =24v, v gs =0 i dss - - 25 a v ds =20v, v gs =0, tj=125 c i d(on) *1 12 - - a v ds =10v, v gs =10v - 6 6.8 m v gs =10v, i d =18a r ds(on) *1 - 9.2 11.8 m v gs =4.5v, i d =12a dynamic ciss - 4753 - coss - 495 - crss - 348 - pf v gs =0v, v ds =15v, f=1mhz
cystech electronics corp. spec. no. : c710q8 issued date : 2009.05.07 revised date : page no. : 3/6 MTB06N03Q8 cystek product specification characteristics (t c =25 c, unless otherwise specified) symbol min. typ. max. unit test conditions qg (v gs =10v) *1, 2 - 53 - qg (v gs =4.5v) *1, 2 - 30 - qgs *1, 2 - 8 - qgd *1, 2 - 17 - nc v ds =15v, v gs =10v, i d =18a t d(on) *1, 2 - 22 - tr *1, 2 - 16 - t d(off) *1, 2 - 65 - t f *1, 2 - 10 - ns v ds =15v, i d =1a, v gs =10v, r gs =2.7 rg - 1.2 - v gs =15mv, v ds =0v, f=1mhz source-drain diode i s *1 - - 4 i sm *3 - - 40 a v sd *1 - - 1.2 v i f =i s , v gs =0v trr - 32 - ns qrr - 12 - nc i f =i s , di f /dt=100a/ s note : *1.pulse test : pulse width 300 s, duty cycle 2% *2.independent of operating temperature *3.pulse width limited by maximum junction temperature. ordering information device package shipping marking MTB06N03Q8 sop-8 (pb-free & halogen-free package) 3000 pcs / tape & reel b06n03
cystech electronics corp. spec. no. : c710q8 issued date : 2009.05.07 revised date : page no. : 4/6 MTB06N03Q8 cystek product specification characteristic curves
cystech electronics corp. spec. no. : c710q8 issued date : 2009.05.07 revised date : page no. : 5/6 MTB06N03Q8 cystek product specification characteristic curves(cont.)
cystech electronics corp. spec. no. : c710q8 issued date : 2009.05.07 revised date : page no. : 6/6 MTB06N03Q8 cystek product specification sop-8 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1909 0.2007 4.85 5.10 i 0.0019 0.0078 0.05 0.20 b 0.1515 0.1555 3.85 3.95 j 0.0118 0.0275 0.30 0.70 c 0.2283 0.2441 5.80 6.20 k 0.0074 0.0098 0.19 0.25 d 0.0480 0.0519 1.22 1.32 l 0.0145 0.0204 0.37 0.52 e 0.0145 0.0185 0.37 0.47 m 0.0118 0.0197 0.30 0.50 f 0.1472 0.1527 3.74 3.88 n 0.0031 0.0051 0.08 0.13 g 0.0570 0.0649 1.45 1.65 o 0.0000 0.0059 0.00 0.15 h 0.1889 0.2007 4.80 5.10 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . marking: 8-lead sop-8 plastic package cystek packa g e code: q8 top view a b front view f c d e g i h part a j k o m l n right side view part a device name date code
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